| 参数 |
技术规格 |
备注 |
| 层数 |
2～16 |
|
| 基材 |
FR4,CEM3, ARLON |
特殊材料按客户要求 |
| 成品板厚 |
0.20 mm ~ 6.00 mm
(8 mil ~ 236 mil) |
|
| 最小芯板厚度 |
0.1mm(4 mil) |
|
| 铜厚 |
min. 1/2 OZ, max. 3 OZ |
|
| 最小线宽线距 |
双面板 |
0.100 mm ( 4 mil ) |
|
| 多层板 |
0.100 mm ( 4 mil ) |
|
| 最小孔径 |
钻出孔 |
φ0.25 mm ( 10mil ) |
|
| 冲出孔 |
φ0.90 mm ( 36 mil ) |
|
| 尺寸公差 |
孔位置 |
±0.075 mm ( 3 mil ) |
|
(W)
线宽 |
±10% |
|
(H)
孔径 |
NPTH±0.03 mm ( 1.2 mil ) |
|
| |
PTH ±0.05 mm ( 2 mil ) |
|
| 外形尺寸 |
±0.10 mm ( 4 mil ) |
|
| |
| 线到边尺寸 |
±0.15 mm ( 6 mil ) |
|
| 板弯曲 |
≤0.5% |
|
| 表面处理 |
Immersion gold / Immersion silver
Immersion Tin / O.S.P / or Lead free HAL |
Immersion Tin、Immersion silver
process-subcon |
| 绝缘测试 |
>10MΩ |
|
Tolerance of S/M opening with TOP
Side and BOTTOM Side registration |
+/- 2mil |
|
| 导通测试 |
25-50Ω |
|
| 测试电压 |
300V(max) |
|
| 最小焊盘测试宽度 |
0.3mm (12mil) |
0.2mm (8mil) with conductive rubber |
| V割 |
生产尺寸 |
110 mm X 100 mm ( min. ) |
|
| 板厚 |
0.40 mm (16mil) min. |
|
| 余厚 |
0.20 mm (8mil) min. |
|
| 公差 |
± 0.1 mm (4mil) |
|
| 槽宽 |
0.50 mm (20mil) max. |
|
| 槽间距 |
15 mm (590mil) min. |
|
| 槽到线距 |
0.45 mm (18mil) min. |
|
| 长条槽 |
Slot size tol.L≥2W公差 |
L：±0.15 mm (6mil)
W：±0.10 mm (4mil) |
Where:
(1)L=Length of slot
(2)W=Width of slot
(3)Min.drill bit size for multi-hit drilling is 0.60mm |
NPTH slot
L：±0.125 mm (5mil)
W：±0.075 mm (3mil) |
| 孔边间距 |
孔径(mm) |
|
|
| 0.30-1.60 |
0.10mm (4mil) |
|
| 1.61-6.50 |
0.15mm (6mil) |
|
| 最小线路到孔边距离 |
PTH hole: 0.13mm (5mil) |
|
| NPTH hole: 0.18mm (7mil) |
|
| 图形对准度 |
线路vs孔 |
±0.075mm (3mil) |
|
| 线路vs二钻孔 |
±0.10mm (4mil) |
|
| 正反面对准度 |
|
0.075mm (3mil) |
|
| 多层板 |
层间错位偏差 |
4 layers: 0.15mm (6mil) max. |
|
| 6 layers: 0.2mm (8mil) max. |
|
| 8 layers: 0.25mm (10mil) max. |
|
| 最小内层线路到板边距离 |
0.225mm (9mil) |
|
| 最小板厚 |
4 layers: 0.35mm (14mil) |
|
| 6 layers: 0.60mm (23.6mil) |
|
| 8 layers: 1.00mm (40mil) |
|
| 板厚公差 |
4 layers: +/-0.13mm (5mil) |
|
| 6 layers: +/-0.15mm (6mil) |
|
| 8 layers: +/-0.15mm (6mil) |
|
| I阻抗控制 |
Typical: 50Ω+/-10% |
|
